US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

Posted On: 2026-11-03

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,832, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of fabri... Read More

US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Nov. 3 for "Interconnect substrate, method of making the same, and semiconductor apparatus" (Japanese Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,833, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Interconnect substrate, method of making the sa... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Manufacturing method of package structure and package structure thereof" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,834, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of package struc... Read More

US Patent Issued to Adeia Semiconductor Bonding Technologies on Nov. 3 for "Bonded structure with interconnect structure" (California Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,835, issued on Nov. 3, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Bonded structure with interconnect... Read More

US Patent Issued to SEOUL VIOSYS on Nov. 3 for "Light emitting device having cantilever electrode, LED display panel and LED display apparatus having the same" (South Korean Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,836, issued on Nov. 3, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea). "Light emitting device having cantilever electrode, LE... Read More

US Patent Issued to FASFORD TECHNOLOGY on Nov. 3 for "Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor device" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,837, issued on Nov. 3, was assigned to FASFORD TECHNOLOGY Co. LTD. (Minami-Alps, Japan). "Dipping apparatus, die bonding apparatus, and manu... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Nov. 3 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,838, issued on Nov. 3, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Chip package structure and method for p... Read More

US Patent Issued to CANON MACHINERY on Nov. 3 for "Position alignment device, position alignment method, bonding device, bonding method, and method for manufacturing semiconductor device" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,840, issued on Nov. 3, was assigned to CANON MACHINERY INC. (Shiga, Japan). "Position alignment device, position alignment method, bonding d... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package having a blocking layer on a solder ball" (South Korean Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,841, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having a blocking layer ... Read More

US Patent Issued to BEIJING YOUZHUJU NETWORK TECHNOLOGY on Nov. 3 for "Chip and method for forming the same, and package structure" (Chinese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,842, issued on Nov. 3, was assigned to BEIJING YOUZHUJU NETWORK TECHNOLOGY Co. LTD. (Beijing). "Chip and method for forming the same, and pa... Read More

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US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Nov. 3 for "Interconnect substrate, method of making the same, and semiconductor apparatus" (Japanese Inventor)

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Manufacturing method of package structure and package structure thereof" (Taiwanese Inventors)

US Patent Issued to Adeia Semiconductor Bonding Technologies on Nov. 3 for "Bonded structure with interconnect structure" (California Inventor)

US Patent Issued to SEOUL VIOSYS on Nov. 3 for "Light emitting device having cantilever electrode, LED display panel and LED display apparatus having the same" (South Korean Inventor)

US Patent Issued to FASFORD TECHNOLOGY on Nov. 3 for "Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor device" (Japanese Inventors)

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Nov. 3 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

US Patent Issued to CANON MACHINERY on Nov. 3 for "Position alignment device, position alignment method, bonding device, bonding method, and method for manufacturing semiconductor device" (Japanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package having a blocking layer on a solder ball" (South Korean Inventors)

US Patent Issued to BEIJING YOUZHUJU NETWORK TECHNOLOGY on Nov. 3 for "Chip and method for forming the same, and package structure" (Chinese Inventors)